Journal of Testing and Evaluation

About this journal

This journal is published in six issues per year. Some issues, in whole or in part, may be Special Issues focused on a topic of interest to our readers.

This flagship ASTM journal is a multi-disciplinary forum for the applied sciences and engineering. Published bimonthly, online only, the Journal of Testing and Evaluation presents new technical information, derived from field and laboratory testing, on the performance, quantitative characterization, and evaluation of materials. Papers present new methods and data along with critical evaluations; report users' experience with test methods and results of interlaboratory testing and analysis; and stimulate new ideas in the fields of testing and evaluation.

Major topic areas are fatigue, fracture, and creep, high/low temperature mechanical testing, fire testing, polymers, elastomers, wood, soils, metallics, additive manufacturing, pavement and construction materials, and statistics. Paper types include technical manuscripts, review articles, technical notes, discussions, closures, editorials, and book reviews. All papers are peer reviewed.

First Look Papers

Note to users: The section First Look Papers contains peer reviewed and accepted articles to be published in this journal. When the final article is assigned to an issue of the journal, the First Look Papers version will be removed from this section and will appear in the associated journal issue.

Issues

2023

2022

2021

2020

2019

2018

2017

2016

2015

2014

2013

2012

2011

2010

2009

2008

2007

2006

2005

2004

2003

2002

2001

2000

1999

1998

1997

1996

1995

1994

1993

1992

1991

1990

1989

1988

1987

1986

1985

1984

1983

1982

1981

1980

1979

1978

1977

1976

1975

1974

1973

Editorial Board

Editor-in-Chief

Dr. M. R. Mitchell, Mechanics & Materials, LLC, Flagstaff, AZ, USA

Editorial Board Members

Dr. Ali Abolmaali, Wayne State University, Detroit, MI, USA
Dr. Aziz Amoozegar, North Carolina State University, Raleigh, NC, USA
Dr. Farhad Aslani, University of Western Australia, Crawley, WA, Australia
Dr. Nemkumar Banthia, University of British Columbia, Vancouver, BC, Canada
Dr. Filippo Berto, University of Padua, Italy, and Norwegian University of Science and Technology, Trondheim
Dr. Krishna Prapoorna Biligiri, Indian Institute of Technology, Tirupati, Andhra Pradesh, India
Dr. Andrew F. Braham, University of Arkansas, Fayetteville, AR, USA
Dr. Andreas J. Brunner, Zürich, Switzerland
Professor Andrea Carpinteri, University of Parma, Parma, ITALY
Dr. Wen-Ruey Chang, Liberty Mutual Research Institute for Safety, Hopkinton, MA, USA
Dr. Dar Hao Chen, Texas A&M University, College Station, TX, USA
Dr. Tong Cui, Qualcomm Packaging, San Diego, CA, USA
Mr. John S. Dick, Alpha Technologies, Akron, OH, USA
Prof. Ying Fang, Xiamen University, Xiamen, China
Dr. Tâmara França, Mississippi State University, Starkville, MS, USA
Dr. Alessandro Gardi, RMIT University, Bundoora, VIC, Australia
Dr. Piotr Gas, AGH University of Science and Technology, Krakow, Poland
Dr. Yu-Ning Louis Ge, National Taiwan University, Taipei, Taiwan
Dr. Meng Guo, Beijing University of Technology, Beijing, China
Dr. Rajeev Kumar Gupta, University of Akron, Akron, OH, USA
Prof. Jim Hartman, AZGaitero Engineering, Tempe, AZ, USA
Dr. Leila Hashemian, University of Alberta, Edmonton, Alberta, Canada
Dr. Maryam Hojati, University of New Mexico, Albuquerque, NM, USA
Mr. Hui-Min (Hui) Huang, National Institute for Standards and Technology (NIST), Gaithersburg, MD, USA
Mr. Thomas S. Jones, Howmet Research Corp., Whitehall, MI, USA
Dr. Amin Joodaky, Michigan State University, East Lansing, MI, USA
Dr. Sreeramesh Kalluri, Ohio Aerospace Institute, Brook Park, OH, USA
Dr. Sivakumar Kandasami, Larsen & Toubro Construction, Chennai, India
Dr. Xiaoming Huang, Southeast University, Nanjing, China
Dr. Xin Kang, Hunan University, Hunan, Changsha, China
Dr. Vistasp Karbhari, University of Texas at Arlington, Arlington, TX, USA
Dr. Behnoud Kermani, The Transtec Group, Inc., Enola, PA
Dr. Yong-Rak Kim, University of Nebraska-Lincoln, Lincoln, NE, USA
Dr. Young Hoon Kim, University of Louisville, Louisville, KY, USA
Dr. Eva Lantsoght, Delft University of Technology, Delft, Netherlands, and Universidad San Francisco de Quito
Dr. Mohammad J. Mahtabi, University of Tennessee at Chattanooga, Chattanooga, TN, USA
Dr. Susan M. Marvin, Federal Bureau of Investigation Laboratory, Quantico, VA, USA
Douglas C. Meier, National Institute of Standards and Technology, Gaithersburg, MD, USA
Dr.-Ing. Miomir Miljković, University of Niš, Niš, Serbia
Dr. Xueqian Ni, Central South University, Changsha, Hunan, China
Mr. Thomas F. O’Connor, Milan, MI, USA
Dr. Božidar V. Popović, University of Montenegro, Podgorica, Montenegro
Dr. Luis Reis, Instituto Superior Técnico, Lisbon, Portugal
Dr. Elena Romeo, University of Parma, Parma, Italy
Dr. Gourab Saha, National Institute of Technology Rourkela, Sundargarh, India
Dr. Rajarshi Saha, Bridgelux, Inc., Livermore, CA
Dr. Scott A. Schroeder, Exponent, Los Angeles, CA, USA
Dr. Steven J. Shaffer, Shaffer Tribology Consulting, Campbell, CA, USA
Dr. Suraj Sharma, University of Georgia, Athens, GA, USA
Dr. Ranganath K. Shastri, Plastics Solutions, Midland, MI, USA
Dr. Punith V. Shivaprasad, Clemson University, Clemson, SC, USA
Dr. Mark Sidebottom, Miami University, Oxford, OH, USA
Dr. Cy (Chor-yiu) Sin, National Tsing Hua University, Hsinchu, Taiwan, R.O.C
Dr. C. Elizabeth Stokes, Mississippi State University, Starkville, MS, USA
Dr. Stein Sture, University of Colorado at Boulder, Boulder, CO, USA
Dr. Xiao Tan, Stevens Institute of Technology, Hoboken, NJ, USA
Dr. Julian Tao, University of Akron, Akron, OH, USA
Dr. Ingrid Tomac, University of California, San Diego, San Diego, CA
Dr. Blanka Tomkova, Technical University of Liberec, Liberec, Czech Republic
Dr. Sabrina Vantadori, University of Parma, Parma, Italy
Dr. Sandra Varnaitė-Žuravliova, Center for Physical Sciences and Technology, Kaunas, Lithuania
Dr. Matthieu Vignes, Massey University Manawatu, Palmerston North, New Zealand
Dr. Hao Wang, Rutgers, The State University of New Jersey, Piscataway, NJ
Dr. Jinfeng Wang, Zhejiang University, Hangzhou, China
Dr. Shuying Wang, Central South University, Hunan, China
Dr. Shaopeng Wu, Wuhan University of Technology, Wuhan, China
Dr. Shenghua Wu, University of South Alabama, Mobile AL, USA
Professor Feipeng Xiao, Clemson University, Clemson, SC, USA
Dr. Yang Xiao, Chongqing University, Chongqing, China
Dr. Fangwei Yu, Chinese Academy of Sciences, Chengdu, China
Dr. Xiong Yu, Case Western Reserve University, Cleveland, OH, USA
Professor Menglan Zeng, Hunan University, Changsha, P.R. China
Dr. Henglong Zhang, Hunan University, Changsha, China

Author Instructions

Submit your paper online using the Online Paper Submittal tab.
You must accept the ASTM copyright transfer agreement.
Submit only original work. Previously published papers are never acceptable.
Author Instructions for best practices and the ASTM Style Manual can be found here.
Provide complete references so all authors get credit for their work and papers are accepted by indexing and literature search services.
Written permission from the copyright holder must be submitted for any quotes, tables, or figures with appropriate credit.
All artwork will appear in color online and in black and white if printed so be sure your color materials are understandable in black and white. This includes text so don’t refer to the “blue” area but rather the dark area, bold line, dotted line, etc.
All papers are reviewed by at least two anonymous peer reviewers.
Your approved, peer-reviewed paper will be copy-edited and formatted. You will be asked to approve the final version.
Upon approval of the edited version, your paper will be published in the electronic journal.

Subscription Information

Individual*

How does it work?

You receive a User ID and Password to login to your subscription.

Online only: $318

*Individual subscriptions provide single user access for 12 months via username and password.

Individual article downloads available for $25 directly from the website

Institutional**

How does it work?

Access is by IP address.

Online only: $492

Please contact Sales or call 1-877-909-ASTM.
**Institutional subscriptions provide single site (one geographic location) access for 12 months via IP address.

For Multi-site subscription and pricing, please contact Sales or call 1-877-909-ASTM.

Subscription Period

This subscription ends 12 months from the day your order is processed.

Read ASTM License Agreement

Indexed In

Impact Factor 1.2

Five Year Impact Factor 1.1

Science Citation Index®

Science Citation Index Expanded™

Chemical Abstracts Service

Current Contents®/ Engineering Computing & Technology

EI COMPENDEX®

Google Scholar

Scopus

Online Paper Submittal Open Access Policy ASTM License Agreement

Details

ISSN: 0090-3973

E-ISSN: 1945-7553

Coden: JTEVAB